SMT SOLDER PASTE STENCILS
OUR SERVICES
Here at Photonics SMT, we produce high quality framed stencils that are designed for high volume screen printing on printed circuit boards. For use in production runs where stencil performance is crucial, framed stencils are unrivaled. A sturdy aluminum frame and a polyester mesh that has been specially created for stretching foils are used. This ensures complete flatness and enables excellent printing results from the first print all the way to the last.
Framed SMT Stencil:
- Excellent for high-volume stencil printing on printed circuit boards
- Extensive Process for smooth aperture walls
- Amazingly clean laser-cut apertures
- Exceptional print performance
- All framed SMT stencils are double bonded to extreme wear
- High consistency/repeatability
- 24-hour turnaround standard
Mini-Stencil:
- Photonics SMT produces mini stencils; small stencils that are used mainly for BGA re-work. For a single BGA footprint on loaded PCBs, mini stencils are made to deposit exact quantities of solder paste. The footprint and aperture diameters of the original manufacturing stencil are replicated in these precise stencils.
- Using mechanical drawings or Gerber data, Photonics SMT can manufacture rework stencils for every type of component, including BGAs.
- Our mini stencil design is adaptable enough to function with both an exclusive BGA rework system and manual printing.
Reball BGA Kit (No Fixtures):
- In order to provide a precise connection between the PCB and the chip, an engineer creates a ball grid array circuit. In certain instances, an older ball joint will require the engineer to recreate the ball solder joints in order to get the most out of that specific BGA chip.